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Wet Process

Wet Process
LW-1055

LW-1055

Parameter
Solid Content30±
Viscosity CPS/25℃100k-40k
100% Modulus(kg/cm2)50-0
Tensile Strength(kg/cm2)≥00
Elongation(%)≥050
Solvent CompostitionDMF
Characteristics & PerformanceGood embossing property, high peeling off strength
UsageShoes, ball